2024
Certification through the MasterCard Quality Management (CQM) System
2023
Certification through the IATF 16949 Quality Management System, demonstrating the capability for the packaging of automotive-grade components.
2022
Completion of the expansion project for the copper wire QFN packaging, achieving a production capacity of 17 million QFN packages per month.
2021
Advancing the localization of specialized carrier tapes for the ID card project, addressing the issue of autonomous control over core security products.
2020
Achieving international SOGIS CC EAL6+ level security certification to establish a QFN production line, equipped with the capacity for mass packaging and testing.
2019
Possessing the capability for laser grooving production and CSP dual-interface module manufacturing, having attained ISO/IEC 27001 information security management system certification, and awarded the honorary title of "Advanced Collective of Central Enterprises" by the Ministry of Human Resources and Social Security and the State-owned Assets Supervision and Administration Commission of the State Council.
2018
Achieving mass production of 240µm ultra-thin non-contact modules, with comprehensive capabilities for manufacturing non-contact modules of various thicknesses ranging from 240µm to 410µm.
2016
Successfully developed CSP four-card and six-card packaging, along with personalized processes, thereby enabling large-scale production.
2015
Become the first domestic enterprise to achieve international SOGIS CC EAL5+ level security certification for chip reduction and dual-interface module packaging in the financial sector.
2014
Establish a WAFER reduction production line equipped with advanced grinding and lamination integrated machines and dicing saws, suitable for the reduction of 8-inch V-Notch and 12-inch wafers.
2012
Establish a CSP production line that transcends traditional standards of smart card module packaging technology, autonomously innovating and designing specialized supporting equipment, thereby successfully developing chip-scale package (CSP) smart card modules and their corresponding packaging processes.
2011
Successfully develop the production process for six miniature cards, enabling direct personalization of these small cards.
2009
Become the packaging hub for social security cards in Beijing and the designated packaging facility for China National Petroleum's fuel cards.
2008
Establish a COB production line equipped with the capability for SiP product packaging and testing.
2006
Obtain certification for the ISO 14001 Environmental Management System.
2004
Become the sole designated packaging factory for Sinopec fuel cards in China.
2002
Become a designated enterprise for the packaging of the second-generation resident identity card modules of the People's Republic of China.
2001
The project "Research on Mass Production Technology for IC Card Chip Packaging" has been honored with the "Outstanding Scientific and Technological Achievement" award, jointly presented by the Ministry of Science and Technology, the Ministry of Finance, the National Development and Reform Commission, and the Ministry of Commerce of the People's Republic of China, as part of the "Ninth Five-Year" National Key Technological Research Program.
2000
To become the designated card packaging vendor for China mobiles.
1999
Achieved certification under the ISO 9001 quality management system.
1995
The company was established on November 21st.
