金狮贵宾会





Integrated Circuit Packaging and Testing

Equipped with advanced multi-chip stacking technology and curved cutting processes, our research and development closely align with market trends, allowing us to swiftly respond to client demands. We have established a comprehensive production management and quality control system, showcasing our expertise in PCB design, through which we offer design services to our clients. Our product offerings include high-capacity SIM cards, TF cards, QFN, and DFN .

Framework products (such as QFN and DFN): Equipped with both digital and analog testing machines to accommodate a diverse array of client testing requirements.

2FF-M2M card

2FF/3FF/4FF





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