金狮贵宾会





Smart Card Module Packaging and Testing

Establish a comprehensive production management and quality control system, with the manufacturing technology for contact (dual-interface) modules and contactless modules at the forefront nationally. Designated by the Ministry of Information Industry and the Ministry of Public Security as one of the designated manufacturers for the national second-generation resident identity card specialized modules, it also undertakes packaging tasks for various industry modules, including financial dual-interface modules, social security, and telecommunications SIM modules.

The capacity for modular encapsulation technology

Product Types

  

Contact Modules, Non-Contact Modules, Dual-Interface Modules

Module Packaging Types

  

UV Adhesive, UV Dam Filling, Black Adhesive, Injection Molding

Non-Contact Module Encapsulation Specifications

  

240µm, 260µm, 300µm, 330µm, 385µm, 400µm

IC FRAME Specifications

  

M3 6-Pin, M28 Pin, Dual-Interface, Non-Contact





XML地图