Wafer Back Grinding and Wafer Dicing
Wafer thinning is the process of processing chips to a specified thickness through mechanical grinding; The chip cutting is done through laser burning
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Smart Card Module Packaging and Testing
Established a complete production management and quality control system, including contact (dual interface) modules and non-contact modules
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Smart Card Packaging and Testing
Adopting fully automatic wire picking technology, reducing manual wire picking and improving efficiency and product stability; Highly integrated equipment
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Engineering Design Services
crystalWith mature substrate design capabilities, our company can currently provide double-layer and four layer boards according to customer needs
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Integrated Circuit Packaging and Testing
The production equipment is globally leading, equipped with first-class multi chip stacking technology and curve cutting technology, and the research and development closely follows market trends
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Card/Integrated Circuit Personalization Data Writing
After years of process research and mass production practice of over 4 billion sheets, IC card packaging and testing technology has been developed by IC card packaging factories
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Hazardous Substance Management Objectives
1. The qualified rate of hazardous substances in incoming materials is 100%
2. No complaints about harmful substances exceeding the standard
RBA policy
The finished products supplied by our company contain metals such as tin (Sn), tantalum (Ta), tungsten (W), gold (Au), cobalt (Co), mica (Mica), etc. (hereinafter referred to as "conflict metals"), which are not mining areas controlled by armed groups in the Democratic Republic of Congo and its neighboring countries
Extracted.
Therefore, our company promises:
1. Do not purchase conflict metals produced from conflict areas
2. Require suppliers to refuse the use of conflict metals from conflict areas and provide a commitment letter
3. Suppliers are required to communicate this requirement to their upstream suppliers
