The chips are processed to a specified thickness through mechanical grinding, while dicing is performed by means of laser ablation or blade cutting to partition the entire wafer into individual chips, facilitating subsequent packaging applications.
1. Wafer thinning diameters: 8 and 12 inches with V-notch.
2. Minimum dicing street width: Minimum = 50 micrometers (for both 8-inch and 12-inch).
3. Minimum thinning thickness: Minimum = 50 micrometers (for both 8-inch and 12-inch).
4. Capability for processing Low-K products.
